FloTHERM PACK (www.flothermpackcom) is a web-based software program which produces reliable, accurate thermal models of IC packages and associated parts with the minimum of effort. Designed to fulfil the industries need for a rapid response to innovations in packaging design, FloTHERM PACK is a web-based application that contains a parametrically-driven menu for each part type. To take advantage of FloTHERM PACK, you use your standard web browser to enter data describing the IC package you want to use. For example, if you want to build a model of a ball grid array (BGA) package, the typical data entry items would include: number of balls, substrate conductivity, die size, and substrate metal layer thickness and coverage. If you don't have detailed information about the internal geometry of yourpart, the JEDEC Library SmartPart wizard in FloTHERM PACK lets you create"best guess" thermal models quickly and easily. All you need to do is answer three or four questions about your component. Utilizing built-in intelligent rules based on common industry design practices, the SmartPart wizard.