T3Ster (pronounced "tri-ster") – The "thermal transient tester" is an advanced thermal tester for thermal characterization of semiconductor device packages.
T3Ster fully implements the new JESD51-14 standard and provides the needed level of measurement accuracy.
T3Ster produces fast, repeatable and accurate thermal characteristics from a wide range of ICs (diodes, BJT-s, J-FET-s and MOSFET-s, thyristors, power LED-s),
including stacked-die and system-in-package devices as well as other semiconductor components.
T3Ster results can be used to create thermal analysis models for further verification.
The data generated by the T3Ster will accurately represent the characteristics of (DUT)
Device under Test in structure function format.
T3Ster extracts & allows comparison of thermal characteristics of more than one DUT simultaneously
The data can be exported to electronics cooling software FloTHERM
How does it Work
T3Ster works on the Static test method defined in JEDEC JESD 51-1 & 51-14
T3Ster involves non destructive process and is repeatable for many times
T3Ster technology is comprised of a flexible range of hardware, including the thermal transient tester station and numerous accessories (thermostat, booster, thermocouple pre-amplifiers, JEDEC standard still-air chambers).
The measurements are controlled through a USB port
T3Ster Master software have inbuilt results post-processing program
The thermal tester forces a packaged semiconductor chip from a "hot" to a "cool" state using a single step change in input power, and the measured internal transient temperature response is used to generate a complete thermal characterization of the package
The equipment yields temperature vs. time trace for a packaged chip in a given environment with resolution of 0.010C & 1 microseconds
The resulting data includes θJA, θJB, & θJC metrics of semiconductor devices, failure locations like die attach delamination & compact thermal model of the DUT
